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BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Penn Engineering Events - ECPv6.18.0//NONSGML v1.0//EN CALSCALE:GREGORIAN METHOD:PUBLISH X-WR-CALNAME:Penn Engineering Events X-ORIGINAL-URL:https://seasevents.nmsdev7.com X-WR-CALDESC:Events for Penn Engineering Events REFRESH-INTERVAL;VALUE=DURATION:PT1H X-Robots-Tag:noindex X-PUBLISHED-TTL:PT1H BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20190310T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20191103T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20200308T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20201101T060000 END:STANDARD BEGIN:DAYLIGHT TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT DTSTART:20210314T070000 END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0400 TZOFFSETTO:-0500 TZNAME:EST DTSTART:20211107T060000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTART;TZID=America/New_York:20200917T104500 DTEND;TZID=America/New_York:20200917T114500 DTSTAMP:20200828T145936Z CREATED:20200828T145936Z LAST-MODIFIED:20200828T145936Z UID:3207-1600339500-1600343100@seasevents.nmsdev7.com SUMMARY:MSE Seminar: "III-V photovoltaic substrate reuse using fracture" DESCRIPTION:Controlled spalling of single-crystal semiconductors is an emerging technique which results in the rapid exfoliation of a thin\, single-crystal layer by propagating fracture parallel to the wafer surface. Spalling fracture has been engineered to controllably and intentionally exfoliate thin film electronic devices from single-crystal semiconductors for the purposes of creating flexible devices or enabling substrate reuse to mitigate costs. The process uses an adhered stressor layer combined with an externally applied mechanical force to initiate and propagate a lateral fracture parallel to the substrate surface. Proof-of-principle device demonstrations have been achieved at wafer scale and in multiple configurations\, showing no loss of performance compared to conventionally processed devices while preserving the wafer for reuse\, reclaim\, or recycling for cost and material savings. In this talk\, examples will be drawn mainly from spalling (100)-oriented Ge and GaAs to illustrate the impact of cleavage system alignment on the resulting fracture morphology and spalling conditions and will include single junction photovoltaic device data. URL:https://seasevents.nmsdev7.com/event/mse-seminar-iii-v-photovoltaic-substrate-reuse-using-fracture/ ORGANIZER;CN="Materials Science and Engineering":MAILTO:johnruss@seas.upenn.edu END:VEVENT END:VCALENDAR