Topological nanowires, topological materials confined in one dimension (1D), hold great promise for robust and scalable quantum computing and low-dissipation interconnect applications, which will transform current computing technologies. To do so, research in topological nanowires must continue to improve their synthesis and properties.

In this talk, I will discuss my group’s efforts to develop a high throughput and precision synthesis method to fabricate 1D topological systems. We employ recently developed thermomechanical nanomolding to extrude single crystal nanowires of topological materials with controlled diameter. I will highlight our transport studies on topological semimetal nanowires for their potential application as extremely scaled, low-resistance interconnects. We demonstrate that the resistivity scaling of topological semimetal nanowires is superior to those of the state-of-the-art Cu interconnects and Cu alternative metals, presenting them as viable candidates for the low-resistance interconnect applications.