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DTSTART;TZID=America/New_York:20190830T153000
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DTSTAMP:20260408T152028
CREATED:20190814T140342Z
LAST-MODIFIED:20190814T140342Z
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SUMMARY:MEAM/LRSM Seminar: "Enabling Soft\, Flexible 2D Materials and Sensors"
DESCRIPTION:Low temperature synthesis of high quality 2D materials directly on flexible substrates remains a fundamental limitation towards realization of robust\, strainable electronics possessing the unique physical properties of atomically thin structures. Here\, we describe room temperature synthesis of uniform\, stoichiometric amorphous MoS2\, WSe2\, and other transition metal dichalcogenides and subsequent large area (>5 cm2) photonic crystallization to enable direct fabrication of devices based on two-dimensional materials on large area flexible or rigid substrates. Fundamentals of crystallization kinetics for different monolithic and heterostructured TMDs are examined to apply this new synthesis approach for affordable\, wearable devices. Example devices include photodetectors with photocurrent output and response times comparable to those fabricated via CVD and exfoliated materials on rigid substrates and the performance is unaffected by strains exceeding 5%. Flexible molecular sensors fabricated in this way detect diverse vapor phase substances with sub-ppm sensitivity. Functionalization of laser-written 2D TMD sensor transducers is also demonstrated for healthcare applications. Devices and circuits directly written from photonically annealed monolithic TMDs thin films deposited on large area flexible substrates\, with no photolithography or patterning\, are also presented. Additionally\, other advanced processing strategies that enable flexible 2D materials will be discussed\, including h-BN van der Waals liftoff of GaN HEMT devices for future strainable RF devices.
URL:https://seasevents.nmsdev7.com/event/meam-lrsm-seminar-enabling-soft-flexible-2d-materials-and-sensors/
LOCATION:Reading Room\, LRSM\, 3231 Walnut Street\, Philadelphia\, PA\, 19104\, United States
ORGANIZER;CN="Mechanical Engineering and Applied Mechanics":MAILTO:meam@seas.upenn.edu
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