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DTSTART;TZID=America/New_York:20250303T110000
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UID:13263-1740999600-1741003200@seasevents.nmsdev7.com
SUMMARY:ESE Spring Seminar - "Versatile RF Interconnects and Electronics for Extreme Environment Sensing and Communications"
DESCRIPTION:Future emerging applications like extreme environment electronics\, high-performance computing\, space sensing\, and brain-machine interfaces share a critical goal: massive bandwidth and deployment scalability. To this end\, my research group is investigating energy-efficient and scalable sensing and communication techniques\, emphasizing circuits\, advanced packaging\, and signal processing innovations for the above applications. \nTo begin with\, I will briefly discuss technology gaps in information-carrying wiring harnesses and illustrate the new use cases of millimeter-wave dielectric fibers and short-distance wireless interconnects as alternative mediums\, mainly as thermal isolating channels. Then\, I will describe the challenges of hypersonic radio interference and harsh environment antenna remoting systems for the DoD and aerospace industries. I will introduce the high-temperature electronics framework as my future work to address the above challenges\, focusing on high-temperature metrology and scalable signal-harnessing techniques at millimeter-wave frequencies. To show the feasibility of the new methods\, I will illustrate the ceramic fiber’s capability of electromagnetic wave propagation\, extreme heat tolerance\, and extreme heat isolation\, assisted by automatic gain-controlled millimeter-wave CMOS transceivers. \nIn the second part\, I will discuss the need for large-scale cryogenic interconnects for future high-performance computing and demonstrate the potential adoption of wireless interconnects between cryogenic devices and room-temperature electronics. As an initiative\, our lab demonstrated the feasibility of removing thermally loaded wires/connectors between 7K and 290K thermal break and efficiently packing more data in a millimeter-wave carrier enabled by multi-level signaling and digital pre-distortion in CMOS technologies. As a part of the scalable interconnect theme within high-performance computing\, I will also describe my collaborative efforts with academic and industry partners on massively scalable RF connectors for future artificial intelligence and data centers. \nLastly\, I will elaborate further on my research activities in space sensing and brain-machine interface\, where massive scalability matters most. I will discuss their challenges\, opportunities\, and future directions.
URL:https://seasevents.nmsdev7.com/event/ese-spring-seminar-title-tba-2/
LOCATION:Raisler Lounge (Room 225)\, Towne Building\, 220 South 33rd Street\, Philadelphia\, PA\, 19104\, United States
CATEGORIES:Colloquium,Symposium
ORGANIZER;CN="Electrical and Systems Engineering":MAILTO:eseevents@seas.upenn.edu
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