In the last decade, there have been major changes in the families of ferroelectric materials available for integration with CMOS electronics.  These new materials, including Hf_1-xZr_xO₂, Al_1-xSc_xN, Al_1-xB_xN and Zn_1-xMg_xO, offer the possibility of new functionalities. This talk will discuss the possibility of exploiting the 3^rd dimension in microelectronics for functions beyond interconnects, enabling 3D non-von Neumann computer architectures exploiting ferroelectrics for local memory, logic in memory, digital/analog computation, and neuromorphic functionality. This approach circumvents the end of Moore’s law in 2D scaling, while simultaneously overcoming the “von Neumann bottleneck” in moving instructions and data between separate logic and memory circuits. Computing accounts for 5 – 15% of worldwide energy consumption. In the U.S., data centers alone are projected to consume approximately 73 billion kWh in 2020. While recent efficiency gains in hardware have partially mitigated the rising energy consumption of computing, major gains are achievable in a paradigm shift to 3D computing systems, especially those that closely couple memory and logic.  The talk will cover the relevant materials, their deposition conditions, and what is known about the wake-up, fatigue, and retention processes.