ESE Spring Seminar – “The Next Leap in Hardware Systems: Powered by Heterogenous Memory, Logic, and 3D Integration”
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Towne 337
Computing is at a critical juncture. Applications such as AI/ML demand much larger memory, higher bandwidth, and lower-energy compute compared to business as usual. New hardware systems, powered by heterogenous memory, logic, and 3D integration, are required for large energy efficiency, throughput, and scaleup benefits. I will present my contributions to three such heterogeneous systems: […]

