High-frequency power converters increasingly require magnetic components that are compact, efficient, and compatible with advanced integration. Conventional ferrites face limitations in scaling and high-frequency performance. This work introduces laminated NiFe magnetic structures fabricated through CMOS-compatible multilayer electroplating as a promising alternative. The materials and fabrication approach are demonstrated through silicon TSV inductors and transformers, PCB-integrated inductors, and discrete coupled inductors and transformers, with system-level evaluation in corresponding practical converter architectures. The results highlight laminated electroplated NiFe as a promising core material for compact, high-frequency power converters.