The era of global digitalization and the increasing prevalence of artificial intelligence-driven data applications have set their sights on terabits per second (Tbps) communication links. The limitations of the rapidly advancing 5G network in meeting this demand, attributed to challenges such as bandwidth scarcity, have spurred the exploration of innovative technologies for the envisioned 6G and beyond (XG) communication. Terahertz (THz) micro-nanotechnologies, leveraging semiconductor and quantum materials, emerge as pivotal contenders for 6G, promising ubiquitous connectivity and breaking down barriers between the physical, digital, and biological realms.

Despite the potential, current THz on-chip devices grapple with significant losses and restricted data speeds. In this context, this talk will present topological insulator-inspired on-chip THz topological photonic integrated circuit for interconnects and wireless devices. These THz silicon devices feature low-loss, broadband interconnects alongside wireless antennas and beamformers achieving speeds surpassing 300 Gbps. Silicon topological photonics is envisioned to pave the way for the advancement of CMOS-compatible hybrid electronic-photonic-driven terahertz technologies. These innovations are important for expediting the evolution of future 6G to XG communications, facilitating real-time terabits per second connectivity. Such a capability extends to compute, network sensing, holographic communication, cognitive internet, and extensive digital replication of both the physical and biological realms.